Embedded OEMs are looking to the latest memory technologies to solve their specific design needs and market demands. But which memory modules provide the most optimal solution for excessive shock and vibration or increased thermal dissipation? And what new testing and validation techniques are being used to reduce overall design risks and increase reliability? Designers must evaluate these factors and other key embedded considerations when specifying memory devices for embedded systems in rugged environments.
refer to: http://embedded-computing.com/articles/ruggedization-memory-module-design/