Acrosser unveils its ultra slim fanless embedded system with 3rd generation Intel core i processor

acrosser Technology Co. Ltd, a world-leading industrial and Embedded Computer
designer and manufacturer, announces the new AES-HM76Z1FL embedded system. AES-
HM76Z1FL, Acrosser’s latest industrial endeavor, is surely a FIT under multiple
circumstances. Innovation can be seen in the new ultra slim fanless design, and
its Intel core i CPU can surely cater for those seeking for high performance.
Therefore, these 3 stunning elements can be condensed as “F.I.T. Technology.”
(Fanless, Intel core i, ultra Thin)

The heat sink from the fanless design provides AES-HM76Z1FL with great thermal
performance, as well as increases the efficiency of usable space. The fanless
design provides dustproof protection, and saving the product itself from fan
malfunction. AES-HM76Z1FL has thin client dimensions, with a height of only 20
millimeters (272 mm x183 mm x 20 mm). This differs from most embedded
appliances, which have a height of more than 50 millimeters.

The AES-HM76Z1FL embedded system uses the latest technology in scalable Intel
Celeron and 3rd generation Core i7/i3 processors with a HM76 chipset. It
features graphics via VGA and HDMI, DDR3 SO-DIMM support, complete I/O such as 4
x COM ports, 3 x USB3.0 ports, 8 x GPI and 8 x GPO, and storage via SATA III and
Compact Flash. The AES-HM76Z1FL also supports communication by 2 x RJ-45 gigabit
Ethernet ports, 1 x SIM slot, and 1 x MinPCIe expansion socket for a 3.5G or
WiFi module.

Different from most industrial products that focus on application in one
specific industry, the AES-HM76Z1FL provides solutions for various applications
through the complete I/O interfaces. Applications of the AES-HM76Z1FL include:
embedded system solutions, control systems, digital signage, POS, Kiosk, ATM,
banking, home automation, and so on. It can support industrial automation and
commercial bases under multiple circumstances.

Key features:
‧Fanless and ultra slim design
‧Support Intel Ivy Bridge CPU with HM76 chipset
‧2 x DDR3 SO-DIMM, up to 16GB
‧Support SATA III and CF storage
‧HDMI/VGA/USB/Audio/GPIO output interface
‧Serial ports by RS-232 and RS-422/485
‧2 x GbE, 1 x SIM, and 1 x MiniPCIe(for3G/WiFi)

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